Monday, April 27, 2015

Blog transfer to "I am a Manufacturing Process Engineer" website

This blog had stop to update and begin to transfer article to new web site call

"I am a Manufacturing Process Engineer (MPE)"

that create by WordPress platform. You are welcome to visit my new website.

Thursday, September 12, 2013

The potential cause for HSC peel off defect


Recently we found many missed segment defect for the HSC (Heat Seal Connector) solution LCM. As experience tell me the reliability of HSC bonding  process is not good for the industrial product. It is easily to miss-contact between the PCB and HSC after a period of use.

I only know the result but I didn’t know why in the past. In order to understand why the HSC bonding force is not good and trial to fix this kind of defect, I collect some information from expert and supplier and study the root cause.

Wednesday, January 2, 2013

Plastic boss crack of mold-in screw insert potential cause


Recently field complained our product had plastic house broken issue. As checked the defect parts and found the crack came from the screw boss till outside house. There is a mold-in screw INSERT part inside the boss. Below will list the screw boss crack potential causes:

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