Thursday, September 12, 2013

The potential cause for HSC peel off defect


Recently we found many missed segment defect for the HSC (Heat Seal Connector) solution LCM. As experience tell me the reliability of HSC bonding  process is not good for the industrial product. It is easily to miss-contact between the PCB and HSC after a period of use.

I only know the result but I didn’t know why in the past. In order to understand why the HSC bonding force is not good and trial to fix this kind of defect, I collect some information from expert and supplier and study the root cause.

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