Plastic boss crack of mold-in screw insert potential cause

Recently field complained our product had plastic house broken issue. As checked the defect parts and found the crack came from the screw boss till outside house. There is a mold-in screw INSERT part inside the boss. Below will list the screw boss crack potential causes:

LCM gasket/cushion design

LCM (LCD Module) is a common component for the electronic products. Almost of the LCM was made by glass and it is brittle and  break easily while hit or drop on the floor due to handle careless. As product design we will install a rubber gasket or cushion locate between the glass and plastic case or metal bezel to prevent it from squeezing due to press or careless hitting.

Although this kind of rubber gasket is a simple design but if the gasket didn’t design well then the installation will be a big challenge in manufacturer. We often see the gasket go outside of the display view area. If this is a touch panel product then it will result the touch function fail. If this kind of issue happens in filed then we will get big trouble.

Therefore, this article attempts to look for the rubber gasket design methods.

Humidity temperature cycle

The humidity test is designed to determine the effects of humidity on the product and assure that the product will meet published specifications while being subjected to high humidity conditions. This is an accelerated test to uncover failure modes in components, assemblies and process, which may appear in the field during normal service, while keeping test time at a minimum. Performance tests are made at various intervals of the test duration and each test must pass for the design to meet the requirements of this section.

Hygroscopic materials (e.g., printed circuit boards, molded plastics, sealed components, etc.) will absorb moisture proportional to the applied vapor pressure and time of application. Excessive moisture penetration may cause swelling of material or contamination actions, destroying functional ability as well as causing leakage paths between sensitive circuits, result when moisture reacts with trapped chemicals from construction processes causing corrosion or severe etching of metal surfaces. In some cases dendritic growth can cause short circuits or high voltage flashover between closely spaced traces or pin spacings. The following humidity test is designed to accelerate the occurrence of these failure mechanisms if they exist.